ANTECEDE TECHNOLOGIES, INC.


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IC packaging processe equipmnet and passive component processe equipment, IC strip laser marking system, binder burn out oven, IC flip chip process equipment, dipping line, IC assembly front-end integration line, IC snap cure system.

Products/Service : IC packaging processe equipmnet and passive component processe equipment, IC strip laser marking system, binder burn out oven, IC flip chip process equipment, dipping line, IC assembly front-end integration line, IC snap cure system.

Website : http://www.ante-tek.com.tw/

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